Manual Soldering Guide

I. Soldering Tool Selection

‌Soldering Iron Selection‌:

• Power: 30-60W for general electronics
• Temperature control: Digital display preferred (200-450℃)
• Tip types: Pointed tip (precision) vs Chisel tip (multi-pin components)

‌Hot Air Gun Selection‌:

• Dual adjustment for airflow/temperature
• Standard nozzles (2-8mm diameter)
• Recommended brands: Quick/Hakko/Weller 

II. PCBA Soldering Considerations

1. ‌Preparation‌:
• Verify PCB version and BOM
• Clean oxidation from pads
• Implement ESD protection
2. ‌Process Control‌:
• Maximum 3 seconds per solder joint
• Form concave fillet shape
• Prevent bridging (critical for <0.5mm pitch ICs)
3. ‌Inspection‌:
• Check wetting angle with 3x magnifier
• Perform ICT testing
• X-ray inspection for BGA joints
• 
  

III. Tool Operation Guidelines

‌Soldering Iron Techniques‌:

• Follow "3C" principle: Clean, Control, Contact
• Set sleep mode to 200℃
• Weekly maintenance with brass wool

‌Hot Air Gun Operation‌:

• Temperature profile:
• Preheat: 120℃/30s
• Soldering: 320-350℃/20s
• Component removal: Circular heating motion
• Safety: Wear high-temperature gloves, maintain 10cm distance